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FEATURED PROJECTS 335
- Next Generation Non Volatile Memory
- Semiconductor Fabrication Materials
- Flexible Printed Circuit Boards
- Printed Circuit Boards (PCBs)
- Superconducting Magnets
- Silicon Reclaim Wafers
- Test / Burn-in Sockets
- FinFET Technology
- High-k and ALD/CVD Metal Precursors
- Semiconductor Advanced Packaging
- Semiconductor (Silicon) Intellectual Property (SIP)
- Superconducting Wire
- Refurbished and Used Mobile Phones
- Semiconductor Assembly and Testing Services (SATS)
- Semiconductor Fabrication Software
- SFF Board
- Soft Magnetic Materials
- Internet of Things (IoT) Chip
- Micro Server IC
- Monolithic Microwave IC (MMIC)
- Foundry Services
- Field Programmable Gate Arrays (FPGA)
- Gallium Arsenide (GaAs) Wafers
- GaN Semiconductor Devices
- Glass Substrates
- GNSS Chips
- Interactive Flat Panels
- Laser Diodes
- Microwave Devices
- Piezoelectric Smart Materials
- Opto Semiconductors
- Power Semiconductors
- Edge Artificial Intelligence Chips
- Embedded Non-Volatile Memory (eNVM)
- High Density Interconnect
- System-in-Package (SiP) Technology
- Semiconductor Foundry
- Industrial Semiconductors
- IC Sockets
- Superconductors
- 3D Chips (3D IC)
- Flat Panel Displays (FPDs)
- Discrete Diodes
- Semiconductor Processing Equipment
- Power Transistors
- GaN Power Devices
- Sapphire Substrates
- Chip Resistors
- Chemical Vapor Deposition
- Non-Volatile Memory Express (NVMe)
- Photocatalysts
- Power Management IC (PMIC)
- PXI Source Measure Units (SMU)
- RF Semiconductors
- Substrate-Like PCB
- Ultracapacitors
- Ultra-Low-Power Microcontrollers
- Semiconductor Photoresist Stripping
- Semiconductor Etch Equipment
- Wafer-Level Manufacturing Equipment
- Wafer Handling Robots
- Smart Card ICs
- Semiconductor Clocks
- Gallium Nitride (GaN) RF Devices
- Analog Semiconductors
- Mixed-Signal Integrated Circuits (IC)
- Front End of the Line Semiconductor Equipment
- Probe Cards
- Rugged Integrated Circuits (IC)
- Nanoimprint Lithography (NIL) Systems
- Bluetooth Integrated Circuits (ICs)
- Special Purpose Logic ICs
- Retimer (Redriver)
- SRAM and ROM Design IP
- Semiconductor Rectifiers
- Fabless IC
- Gate Driver ICs
- Reset Integrated Circuits
- Radio Frequency Integrated Circuits (RFICs)
- Mask Alignment Systems
- Evaluation Boards
- Board-to-Board Connectors
- Computer Microchips
- Digital Micromirror Devices
- Direct Write Semiconductors
- Direct-to-Chip Liquid Cooling
- Epitaxial Wafers
- Fan-Out Wafer Level Packaging
- Fault Detection and Classification
- Fault Detection and Classification (FDC)
- Film Bulk Acoustic Resonator Filters (FBAR)
- Gallium Nitride Semiconductor Devices
- GaN & SiC Power Semiconductor
- GaN LED Chips
- GaN Substrate
- Graphic Processor
- High Frequency High Speed Copper Clad Laminate
- Hybrid Memory Cubes
- Image Signal Processor
- Industry 5.0
- Infrared Emitters & Receivers
- InP Wafers
- Large Scale Medium Voltage Drives
- Large Scale Variable Frequency Drives
- Leak Detection and Repair
- LED Chip
- LED Lamp
- LED Modular Display
- LED Module
- LED Neon Lights
- Linear Motion Bearing
- Low Voltage Drives
- Medium Format Film Cameras
- Metal Core PCB
- Military & Defense Semiconductor
- Motor Driver IC
- Near-Eye Displays
- Next-Generation Solar Cells
- Outsourced Semiconductor Assembly and Test (OSAT) Services
- Semiconductor Bonding
- Semiconductor Dry Etch Systems
- Semiconductor Fabless
- Vibration Control Systems
- Wafer Cases
- Wafer Vacuum Assembling Equipment
- Autonomous Vehicle Chips
- Carbon Resistors
- High Resistivity Silicon Wafers
- High-Reliability Semiconductors
- Integrated Voltage Regulators
- Logic Semiconductors
- RFID Chips
- Semiconductor Etching Equipment
- Semiconductor ICP-MS System
- Semiconductor Metrology Equipment
- SiC Power Device
- Space Semiconductors
- 3D Through-Silicon Via (TSV) Package
- 5G Printed Circuit Boards
- 5G Semiconductor Solutions
- 5G Substrate Material
- Absolute Optical Encoders
- Advanced Materials for Display Technology
- ALD and CVD Precursor for Semiconductors
- Analog Integrated Circuits for Automotive
- Analog to Digital Converter Integrated Circuits
- Artificial Intelligence Processors
- Barcode Plastic Cards
- Blue Laser Diodes
- Broadband Power Line Communication Chipsets
- Cathodic Protection
- Chip Power Inductors
- Computer and Networking OSAT
- Converter Modules
- Current Sense Amplifiers
- Dielectric Materials for Display
- Digital Comparators
- Discrete Power Devices
- Double Layer FPC Technology
- Dry Etching Equipment
- Electrically Erasable Programmable Read-Only Memory (EEPROM)
- Envelope Tracking Chips
- Epitaxial Wafer and Chip Technology
- Epitaxial Wafers in Compound Semiconductors
- Epoxy Resin PCB Laminates
- Etch Process
- Ethernet Network Isolators
- Flex-Rigid FPC Technology
- FPC in Telecommunications
- Fully Automatic Probe Stations
- Fused Quartz Rods
- Gallium Arsenide (GaAs) Electronic Devices
- Gallium Arsenide (GaAs) RF Devices
- Gallium Arsenide (GaAs) RF Semiconductors
- Gallium Nitride Power Devices
- Glass Fabric PCB Laminates
- Graphic Add-in-Boards
- Hard Disk Drives (HDD)
- High-Density Interconnect PCBs
- High-K Dielectric Materials
- Human Microchipping
- IC Substrates in PCBs
- Industrial FPC
- Ion Beam Technology
- Ionic Film Memristors
- Limiter Diodes
- Linear Regulator Power Management IC
- Liquid On Silicon
- Liquid Photoresists
- Lithography Materials
- Logic Integrated Circuits
- Low Dielectric Resins
- LVDS Interface IC
- Mask PROM and EPROM
- MCU-Embedded WiFi Chips
- Medical Microelectromechanical Systems
- Metal Sputtering Target Materials
- Micro Integrated Circuits
- Microchip Electrophoresis
- Microelectronics Cleaning Equipment
- Network Synchronization ICs
- OLED Materials
- PCB Manufacturing Equipment
- PCBs in Communications
- Pellicle
- Photosensitive Semiconductor Devices
- Pin Fin Heat Sink for IGBT
- PMOLEDs
- Porous Silicon Substrates
- Processor Power Modules
- Programmable Silicon
- QUBIT Semiconductor
- Real-Time Clock
- Rectifier Diodes
- RF GAN Devices in Telecom Infrastructure
- RF Transceivers
- Rigid 1-2 Sided in PCBs
- Rigid PCBs
- Rigid-Flex PCBs
- Safety IO Modules
- Semiconductor Bearings
- Semiconductor Capital Equipment
- Semiconductor Dielectric Etching Equipment
- Semiconductor Dry Strip Equipment
- Semiconductor Etching Agents
- Semiconductor Gas
- Semiconductor Metal Heaters
- Semiconductor Metrology and Inspection
- Semiconductor Polishing Pads
- Semiconductor Wafer Polishing and Grinding Equipment
- Semiconductor Wafer Transfer Robots
- Semiconductor Wet Etch Systems
- Serial SPI NOR Flash
- Silica Glass for Semiconductors
- Silicon EPI Wafers
- Silicon Lenses
- Silicon Platform as a Service
- Silicon Wafer
- Silicon-based Anode Materials
- Smart Network Interface Cards (NIC)
- Smartphone Nand Memory
- Smartwatch Chips
- Solder Bumping Flip Chips
- Sputtering Targets and Sputtered Films
- Standard Multilayers in PCBs
- Stencil Lithography
- Stick PCs
- Telecommunications and Devices OSAT
- Toggle-MRAM
- Trusted Platform Modules
- Tunnel Field Effect Transistors
- Visible and UV Laser Diodes
- Voltage Supervisor ICs
- Wafer Fab Equipment
- Wafer Temperature Measurement Systems
- Zener Diodes
- 3D NAND Memory
- Adjustable Mode Beam Lasers
- Artificial Intelligence (AI) Audio and Video SoC
- Automatic Door Sensors
- Bluetooth IC
- Converged Data Center Infrastructure
- Diffractive Optical Element
- Edge AI Processors
- Electronic Filters
- Epitaxy Equipment
- Error Correcting Code (ECC) Memory
- Flash Memory
- Gallium Arsenide Components
- GaN (Gallium Nitride) on Silicon (Si) Epitaxial (EPI) Wafers
- GaN Powered Chargers
- HDR Video Cameras
- Industrial Endoscopes
- Intelligent Energy Storage Systems
- IT Asset Reuse
- LAN Cables
- LCD TV Core Chips
- LED Driver ICs
- LED OLED Displays
- Low Power Next Generation Displays
- Memory and Processors for Military and Aerospace
- Mid-Wave Infrared (MWIR) Sensors
- Multi Cuvette Spectrophotometers
- Multilayer Transparent Conductors
- Nitrogen Gas Springs
- Outsourced Semiconductor Assembly and Testing (OSAT)
- Panoramic Cameras
- Radio Transmitters
- Reference Designs
- RF Front-End Chips
- Sealless Pumps
- Semiconductor IP
- Semiconductor Manufacturing Back-End Equipment
- Semiconductor Memory IP
- Serial NOR Flash
- Smartphone System on Chip (SoC)
- Speaker Drivers
- Spoil Detection-based Smart Labels
- Static Random Access Memory
- Storage Adapters
- Vision Inspection Systems
- VPX Single Board Computers (SBC)
- Wafer Fabrication
- Waterproof Security Cameras
- Wireless Chipsets
- Wireless Power Receivers
- 3D TSV and 2.5D
- Advanced IC Substrates
- Artificial Intelligence (AI) in Modern Warfare
- Bar Type Current Transformers
- Coherent Optical Equipment
- Composite Current Collectors
- Connected Home Security Devices
- Co-Packaged Optics
- Digital Gaussmeters
- Display Panels
- GaN Industrial Devices
- Gate-All-Around FET (GAAFET)
- Hollow Core Optical Fibers
- Ion Implantation Machines
- Laser Micro Perforation Equipment
- Magneto Elastic Torque Sensors
- Multilayer Printed Circuit Boards
- PCB Connectors
- Pulse Transformers
- Semiconductor and Circuit Manufacturing
- Semiconductor Applications in Healthcare
- Semiconductor Consumables
- Semiconductor CVD Equipment
- Semiconductor Devices in Consumer Sector
- Semiconductor Seals
- Silicon Carbide (SiC) MOSFET Chips and Modules
- Silicon Carbide (SiC) Wafer Polishing
- Silicon Carbide (SiC) Wafers
- Traction Inverters