3D Semiconductor Packaging

A Global Strategic Business Report

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OCT 2025

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HIGHLIGHTS & REPORT INDEX

Global 3D Semiconductor Packaging Market to Reach US$33.7 Billion by 2030

The global market for 3D Semiconductor Packaging estimated at US$13.4 Billion in the year 2024, is expected to reach US$33.7 Billion by 2030, growing at a CAGR of 16.6% over the analysis period 2024-2030. Through Silicon via (TSV), one of the segments analyzed in the report, is expected to record a 19.3% CAGR and reach US$18.4 Billion by the end of the analysis period. Growth in the Package-on-Package segment is estimated at 15.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$1.6 Billion While China is Forecast to Grow at 20.5% CAGR

The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.6 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$9.7 Billion by the year 2030 trailing a CAGR of 20.5% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 11.6% and 12.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 15.4% CAGR.

Global 3D Semiconductor Packaging Market - Key Trends & Drivers Summarized

What Is 3D Semiconductor Packaging?

3D semiconductor packaging is a cutting-edge technology that involves stacking silicon wafers or die and interconnecting them vertically to form a single package. This method contrasts with traditional flat, 2D layouts, providing numerous advantages, including reduced space consumption, enhanced performance, and lower power usage. The innovation lies in its ability to integrate more components into a compact space, thereby significantly improving the functionality and efficiency of electronic devices. As consumer electronics continue to evolve towards sleeker, more powerful, yet more energy-efficient models, 3D packaging becomes critically important. This technology is pivotal in industries such as smartphones, computers, servers, and in the automotive sector, where manufacturers demand high-performance components that occupy minimal space.

How Does Technology Advance Drive Changes?

The relentless push for smaller, faster, and more efficient electronic devices has significantly driven advancements in 3D semiconductor packaging technology. As the limitations of traditional 2D packaging become more apparent—especially in terms of power efficiency and speed—3D packaging has emerged as a vital solution. This technology utilizes innovative methods such as through-silicon vias (TSVs), which are vertical electrical connections passing completely through silicon wafers or dies to stack them densely. These advancements not only help in achieving higher bandwidth and better electrical performance but also in reducing latency and power consumption. Moreover, the integration of heterogeneous components, which can be made of different technologies and functionalities, into a single package is facilitating new design architectures in electronics, particularly for applications requiring high computational power, such as artificial intelligence and big data analytics.

What Role Do Market Demands Play?

Market demands across various sectors significantly shape the development and adoption of 3D semiconductor packaging. In the consumer electronics market, there is a constant demand for devices that offer more power in a smaller package, driving the need for sophisticated packaging solutions like 3D semiconductor packaging. Similarly, the automotive industry, with its increasing focus on electric and autonomous vehicles, requires high-performance computing capabilities that can only be achieved with advanced semiconductor packaging. The healthcare sector, too, utilizes this technology in medical devices that demand reliability, longevity, and miniaturization. As these sectors continue to grow, they collectively push the envelope on the capabilities of semiconductor packaging technologies, making 3D solutions not just preferable but necessary.

What Drives the Market for 3D Semiconductor Packaging?

The growth in the 3D semiconductor packaging market is driven by several factors, starting with the rapid advancement of technology in sectors such as telecommunications, automotive, and consumer electronics, where there is a continuous demand for miniaturization and enhanced performance. Additionally, the integration of IoT devices into everyday life and the increasing reliance on cloud computing and data centers fuel the need for powerful yet compact semiconductor solutions. Economic factors also play a crucial role; as the cost of 3D semiconductor manufacturing technologies decreases, it becomes more accessible to a broader range of manufacturers, further boosting market growth. The push for more environmentally friendly electronic solutions also drives advances in 3D semiconductor packaging, as it offers significant energy efficiency benefits.

SCOPE OF STUDY

The report analyzes the 3D Semiconductor Packaging market by the following Segments, and Geographic Regions/Countries:

Segments:

Packaging Method (Through Silicon via (TSV), Package-on-Package, Through Glass via (TGV), Other Packaging Methods); End-Use (Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace, Other End-Uses).

Geographic Regions/Countries:

World; USA; Canada; Japan; China; Europe; France; Germany; Italy; UK; Rest of Europe; Asia-Pacific; Rest of World..

SELECT PLAYERS

IBM Corporation; 3M Company; Intel Corporation; Advanced Micro Devices, Inc.; Applied Materials, Inc.; Amkor Technology, Inc.; Cadence Design Systems, Inc.; Globalfoundries, Inc.; Jiangsu Changjiang Electronics Technology Co., Ltd.; ASE Technology Holding Co., Ltd.; AT & S Austria Technologie & Systemtechnik AG; 3D PLUS SA; LPKF Laser & Electronics AG; China Wafer Level CSP Co., Ltd.; EV Group Europe & Asia/Pacific GmbH

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TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Tariff Impact on Global Supply Chain Patterns

3D Semiconductor Packaging – Global Key Competitors Percentage Market Share in 2025 (E)

Competitive Market Presence - Strong/Active/Niche/Trivial for 36 Players Worldwide in 2025 (E)

Semiconductor Advanced Packaging: A Prelude

An Introduction to 3D Semiconductor Packaging

Global Market Prospects & Outlook

Primary Growth Drivers

3D Packaging Reinventing Integration Architectures

Analysis by Segment

Regional Analysis

Competitive Scenario

Recent Market Activity

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

3D IC Packaging Market to Experience Robust Growth

Demand for 3D Packaging to Boost Advanced Semiconductor Packaging Market

Digital Transformation Drive Energizes the Growth in Advanced Packaging Market

IoT Ecosystem Accelerates Opportunities for Semiconductor Advanced Packaging

EXHIBIT: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025

EXHIBIT: Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025

IC Makers Continue to Move towards Advanced Semiconductor Packaging

Transition towards Advanced Packaging

Increasing Functionality & Application Scope of Semiconductor/IC Packages

New Packaging Technologies Crucial to Semiconductor Innovation

Demand for Compact, High Functionality Electronic Devices to Impel 3D TSV Packages Market

3D Chip Stacking Technology to Drive Future Advanced Packaging Technology

3D InCites - Advanced Packaging for 5G

Advanced Packaging Influences Design Chain

Interposers for Semiconductor Packaging Applications

Innovative Advanced Packaging Techniques to Flood the Market

Reducing the Cost of Advanced Packaging

Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market

Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology

Smartphones

Tablet PCs

Automobile Electronification Trends Widen the Addressable Market

EXHIBIT: Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030

Sustained High Growth in ICT Sector Augurs Well

4. GLOBAL MARKET PERSPECTIVE

World Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Through Silicon via (TSV) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Package-on-Package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Through Glass Via (tgv) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Other Packaging Methods by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

World 3D Semiconductor Packaging Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030

III. MARKET ANALYSIS

UNITED STATES

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)

USA Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

USA Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

USA 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

USA Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

USA Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

USA 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

CANADA

Canada Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Canada Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Canada 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Canada Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Canada Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Canada 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

JAPAN

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)

Japan Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Japan Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Japan 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Japan Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Japan Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Japan 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

CHINA

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)

China Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

China Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

China 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

China Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

China Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

China 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

EUROPE

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)

Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR

Europe Historic Review for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Europe 15-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030

Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Europe Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Europe 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Europe Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Europe 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

FRANCE

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)

France Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

France Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

France 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

France Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

France Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

France 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

GERMANY

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)

Germany Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Germany Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Germany 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Germany Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Germany Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Germany 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

ITALY

Italy Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Italy Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Italy 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Italy Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Italy Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Italy 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

UNITED KINGDOM

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)

UK Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

UK Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

UK 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

UK Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

UK Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

UK 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

REST OF EUROPE

Rest of Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Rest of Europe Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Rest of Europe 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Rest of Europe Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Rest of Europe Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Rest of Europe 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

ASIA-PACIFIC

3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)

Asia-Pacific Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Asia-Pacific Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Asia-Pacific 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Asia-Pacific Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Asia-Pacific Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Asia-Pacific 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

REST OF WORLD

Rest of World Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Rest of World Historic Review for 3D Semiconductor Packaging by Packaging Method - Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Rest of World 15-Year Perspective for 3D Semiconductor Packaging by Packaging Method - Percentage Breakdown of Value Sales for Through Silicon via (TSV), Package-on-Package, Through Glass Via (tgv) and Other Packaging Methods for the Years 2015, 2025 & 2030

Rest of World Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR

Rest of World Historic Review for 3D Semiconductor Packaging by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR

Rest of World 15-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2015, 2025 & 2030

COMPETITIVE METRICS

COMPETITORS (ALPHABETICAL)	% VALIDATED RESEARCH *
3D PLUS SA	%
3D Systems, Inc.	%
3M Company	%
Advanced Micro Devices, Inc.	%
Advanced Semiconductor Engineering, Inc.	%
Amkor Technology, Inc.	%
Applied Materials, Inc.	%
Arteris, Inc.	%
ASE Technology Holding Co., Ltd.	%
AT & S Austria Technologie & Systemtechnik AG	%

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